IC appearance inspection equipment
IC appearance inspection device
The CSP/BGA/WLCSP solder bumps are inspected quickly and accurately. It is equipped with a revolutionary image processing device that differs from conventional methods. The difference is more pronounced with smaller bump diameters and narrower pitches compared to conventional machines. The PVI-500 is a standalone unit with a single tray supply type, suitable for small lot inspections. The inspection unit can accommodate both 2D and 3D capabilities.
- Company：新光エンジニアリング
- Price：Other
